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Anti-tracking co-encapsulation photonics test report

Dec 09, 2025

Scale manufacturing test for high-bandwidth co

As the standards above speak to, co-packaged optical devices have a channel density unlike any subassembly ever developed, which means existing test

Nov 02, 2025

Advances and challenges in portable optical biosensors for onsite

Sensing elements can be encapsulated in biocompatible polymers, guaranteeing compatibility with biological samples and minimizing the interference from surroundings. This

Apr 23, 2026

Testing Strategies for Next-Generation Optical Interconnects: Co

Quantifi Photonics ofers a wide selection of optical and electrical test functions that can be used to build a complete optical test bench, from fixed and tunable lasers to multi-channel photodetectors, as well

Jun 04, 2026

Co-packaged optics (CPO): status, challenges, and

Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically

Dec 29, 2025

Progress in Research on Co-Packaged Optics

Compared to typical optoelectronic connectivity technology, CPO presents distinct benefits in terms of bandwidth, size, weight, and power consumption. This study presents an

Jun 09, 2026

Photonic Integrated Circuits: Research Advances and

Silicon photonics, serving as a cornerstone technology in modern information technology, demonstrates significant application potential in critical

Feb 28, 2026

ACS Publications | Peer-Reviewed Chemistry Journals, Scientific

ACS Publications offers cutting-edge research and insights in photonics, exploring innovative applications and advancements in the field.

Oct 29, 2025

Axially chiral molecular contacts with low isomerization

A non-coplanar axially chiral molecular contact favours the crystalline growth of perovskite film and improves interfacial stability in perovskite solar

Nov 18, 2025

Towards efficient, scalable and stable perovskite/silicon

This Review covers the latest advances in perovskite/silicon tandem solar cells, with a focus on efficiency, stability and scalability, along with a discussion of outstanding challenges and

Jan 17, 2026

The Evolution of Co-Packaged Optics (CPO) Advanced Testing

Why Must CPO Use Single Mode Fiber (SMF)? The silicon photonics waveguide itself is single-mode — light leaving the ASIC is fundamental-mode from the start. Using SMF is not a design choice for

Dec 07, 2025

Silicon Photonics(SiPh) and Co-Packaged Optics(CPO) Report, 2025

Overview: The Annual Silicon Photonics and Co-Packaged Optics Report highlights how the rapid advancement of AI is driving explosive growth in demand for high speed, high capacity data

Dec 11, 2025

1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged

Abstract: Co-packaged optics (CPO) has emerged as a promising solution to address the limitations of traditional pluggable optical transceivers, offering enhanced bandwidth, improved

Feb 08, 2026

Co-packaged optics (CPO): status, challenges, and

Co-packaged optics (CPO) combines photonic devices with high-performance electronics via advanced packaging to form a solution that shortens

May 13, 2026

Co-Packaged Optics: Technical Barriers and the Road to Mass

TSMC-SoIC face-to-face (F2F) technology for EIC and PIC bonding. A packaging war? Taiwan possesses a comprehensive and fully developed semiconductor manufacturing ecosystem. Taiwan

Jul 09, 2026

Laser Photonics Completes Proof of Concept Testing for Fonon

The LSAD is a cutting-edge solution in development for the deterrence of unauthorized drone activity. Designed by Fonon in conjunction with Laser Photonics.

May 30, 2026

Upconverting nanoparticles for biomedical applications

Lanthanide-doped upconverting nanoparticles enable nonlinear anti-Stokes light conversion, which has shown unique photophysics and cross-disciplinary, particularly biomedical,

Dec 30, 2025

Testing Considerations for High-Density Co

At Quantifi Photonics, we recognize the urgency of supplying high-channel, high-density test equipment that will help make the proliferation of co-packaged optical devices a reality.

Nov 17, 2025

Review of Optical Fiber and Integrated Photonic Sensors for

Photonic integrated circuits (PICs) shift transduction to compact node-level devices for localized thermal, mechanical, refractive-index, absorption, vibration, and inertial measurements,

Feb 19, 2026

Guest Encapsulation in Metal–Organic Frameworks for

Photonic functional materials have received mounting attention because of their employment in luminescent sensing, display, white-light

Jul 25, 2025

Next-Gen Optics Need Next-Gen Materials: CPO

Looking ahead, we see a clear trend toward heterogeneous integration of light sources directly within photonic systems—sometimes referred

Dec 01, 2025

Evaluating Co-Packaged Optics (CPO) Performance

Anritsu has a wide range of test solutions including BERT, sampling oscilloscopes, optical spectrum analyzer, Ethernet testers, etc., offering ideal solutions. For evaluating CPO performance, Anritsu

Apr 30, 2026

HVM Testing for Silicon Photonics and Co-Packaged Optics Devices

HVM Testing for Silicon Photonics and Co-Packaged Optics Devices: Challenges and Solutions

Mar 30, 2026

Electronic Chip Package and Co-Packaged Optics

Meanwhile, the optical module, enabled by silicon photonics, is now treated similarly to electronic chips, and advanced co-packaged optics (CPO) is

Sep 21, 2025

In situ n-doped nanocrystalline electron-injection-layer for general

Zheng et al. report water vapor treatment for in-situ n-doping of ZnMgO, enabling ideal ohmic electron transport and hole blockage as the electron injection layer for quantum dot light

Aug 05, 2025

Co-Packaged Optics (CPO) Technology Full Module Test Vehicle

Abstract: We built co-packaged optics modules having polymer waveguide fiber interfaces successfully. We tested two types of assembly orders with Photonic-Integrated-Circuit (PIC) to Polymer Optical

Sep 08, 2025

Biomaterials and Encapsulation Techniques for

A range of materials can be utilized for encapsulating probiotics, and several methods can be employed for this encapsulation process. This article

Feb 19, 2026

Packaging solutions photonics, RF and microelectronics

Advanced packaging solutions of RF and photonics components for applications in 5G and 6G, aerospace and defence and security is needed to achieve low power

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