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  • Hot aisle size parameters for cloud computing

    Hot aisle size parameters for cloud computing

    Maximum Aisle Length: When equipment cabinets form a continuous row, the aisle length should not exceed 16 meters. Hot aisle containment (HAC) takes advantage of the natural properties of warm air rising. The HAC. This guide provides an overview of best practices for energy-efficient data center design which spans the categories of information technology (IT) systems and their environmental conditions, data center air management, cooling and electrical systems, and heat recovery. Most systems and storage products are designed to pull chilled air through the front of the system and exhaust hot air out of the back. The most. ASCE 7-22, Minimum Design Loads and Associated Criteria for Buildings and Other Structures, specifies a 100 psf distributed load or 2,000-pound point load for “Computer use – Access floor systems. ” United Facilities Criteria (UFC) 3-301-01 (2018) specifies 150 psf for “Telephone exchange rooms and. Hot aisle and cold aisle containment are foundational concepts in data center design. When implemented correctly, they improve efficiency, reduce energy consumption, extend equipment life, and enhance overall reliability.

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  • High-speed optical module AI computing power

    High-speed optical module AI computing power

    Using advanced optical modules boosts AI system speed and bandwidth, helping handle large data loads with low delay and high efficiency. Understanding their role is key to building efficient, scalable AI systems. Optical modules convert electrical signals into light to move data quickly and reliably in. Researchers at Tsinghua University developed the Optical Feature Extraction Engine (OFE2), an optical engine that processes data at 12. Traditional hot-pluggable optical modules are evolving from a single-lane configuration operating at 224 Gbps PAM4 toward systems supporting 800 G and 1. In all these configurations—cable modules, traditional. Lightcounting has provided insights into market trends for high-speed optical modules, and some companies have referenced this data to suggest that LPO modules will become a critical low-power, low-latency option for AI applications in the 800G (and future 1. 9, 2024: IBM (NYSE: IBM) has unveiled breakthrough research in optics.

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  • Huijue builds the most powerful server for AI applications

    Huijue builds the most powerful server for AI applications

    The company also announced new supercomputing systems, the Atlas 950 and Atlas 960, described as the “world's most powerful”, capable of linking 8,192 and 15,488 chips, respectively. These systems are also known as 'superclusters. 'Huawei Technologies Co has built a robust ecosystem around its Ascend chips for AI computing and its server chips Kunpeng, despite the US government's restrictions. Zhou Jun, head of ICT marketing department at Huawei, said in a recent speech in Beijing that the company has attracted over 6. 65. Furthermore, 970 will debut in 2028. A Vietnamese shop, Nguyencongpc (via I_Leak_VN). Building your own AI server isn't just a technical project, it's a bold step toward empowering yourself with flexibility and independence. Imagine running complex machine learning models, generating stunning AI-driven visuals, or training large language models, all from a server you've designed and. China's domestic AI chips took 41% of the accelerator server market in 2025. New data shows Huawei alone shipped roughly 812,000 AI chip units last. Recently, Huijue Group has achieved remarkable results in the AI optimal tuning energy-saving project.

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  • Saudi Arabia offers 100G AI server

    Saudi Arabia offers 100G AI server

    HUMAIN and Qualcomm Technologies announced a transformative collaboration to deploy advanced AI infrastructure in Saudi Arabia. This initiative will offer global AI inferencing services and be the world's first fully optimized edge-to-cloud hybrid AI. In this partnership, Cisco will provide vital networking and infrastructure solutions, whereas AMD will contribute its state-of-the-art MI450 AI. Joint venture to deliver up to 1 GW of AI infrastructure by 2030, starting with a 100 MW deployment in the Kingdom of Saudi Arabia to power the Global AI ecosystem with cost-efficient, high-performance infrastructure News Summary AMD, Cisco and HUMAIN to invest in a joint venture and serve as its. Collaboration to establish Saudi Arabia as a global AI hub through world's first fully optimized edge-to-cloud services of advanced AI data centers HUMAIN and Qualcomm Technologies, Inc.

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  • 1 6T Low Temperature Resistant Optical Module for Edge Computing

    1 6T Low Temperature Resistant Optical Module for Edge Computing

    6T 2×DR4 TRO OSFP transceiver delivers ultra-high-speed optical connectivity for AI and cloud data centers requiring the highest density and energy efficiency. These modules perform the critical function of converting electrical signals into optical signals, and vice versa. 5 Gbps PAM4 per lane for an aggregate data. The OSFP-1. This article provides a guide to selecting 1. Why Choose. Now let's take a look at the four revolutionary leaps that the optical transceiver industry has experienced over the past decade: Phase 1: 100G Era (2015-2018) Phase 2: 400G Breakthrough (2019-2022) Phase 3: 800G Commercialization (2023-2025) Phase 4: 1. 6T Feature (2025-2027) Driven by the dual. With the rapid rise of large AI models and hyperscale data centers, 1.

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  • Immersion Liquid Cooling for Temperature-Controlled Server Racks in Intelligent Computing Centers

    Immersion Liquid Cooling for Temperature-Controlled Server Racks in Intelligent Computing Centers

    Immersion cooling absorbs 100% of rack heat — but room cooling remains essential for air quality and humidity management. Data center operators are evaluating liquid cooling technologies to increase energy efficiency as processing-intensive computing applications grow. According to the Dell'Oro Group, the liquid cooling market revenue approach $2B by 2027 with a 60% CAGR for the years 2020 to 2027, as organizations. LiquidCool Solutions is the only company combining Total Liquid Immersion with Directed Flow (direct-to-chip) in a standard 19″ rack. Our products are easy to install and suited for. Advanced AI chips are generating more heat in data centers, necessitating improved cooling solutions. Immersion cooling is a liquid-based thermal management technology in which complete servers are fully submerged in a dielectric, electrically non-conductive fluid. It is a core architectural decision.

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  • AI Servers for Manufacturing

    AI Servers for Manufacturing

    While semiconductor giants like NVIDIA and AMD develop the hardware that powers AI servers, specialized AI companies like TensorWave, Lambda Labs, and Cerebras Systems are redefining AI and HPC performance with custom-built servers. So, which company leads in AI chip manufacturing?Artificial Intelligence (AI) server manufacturers have experienced surging demand as data center operators require significantly more computing power than before the advent of ChatGPT and other Generative Artificial Intelligence (Gen AI) tools. Enterprises are investing billions of dollars in cloud. Server with GPU: for your AI and machine learning projects. Get AI models and tools such as DeepSeek or Ollama running on our dedicated GPU servers and tag us on Hugging. The global AI server market is expected to be valued at USD 142. 83 million by 2030 and grow at a CAGR of 34. (US), Hewlett Packard Enterprise Development LP (US), Lenovo (Hong Kong), Huawei Technologies Co. This comprehensive guide moves beyond a mere list, offering procurement managers and enterprise buyers actionable insights into.

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  • Qualcomm AI Server Motherboard Model

    Qualcomm AI Server Motherboard Model

    From Qualcomm's vantage point, the AI200 and AI250 deliver rack-scale performance and superior memory capacity at an industry-leading total cost of ownership (TCO), with optimized performance for large language models (LLMs) and large multimodal models (LMMs). The cards interface to the host via PCIe and to the BMC via SMBus/I2C. The Cloud AI 100 Ultra SKU has 4. Qualcomm is moving from mobile NPUs into rack-scale AI infrastructure, positioning its AI200 (2026) and AI250 (2027) to challenge Nvidia/AMD on the economics of large-scale inference. Qualcomm is entering this evolving market with its Dragonfly platform, aiming for $15 billion in revenue by 2029. The stock soared 11% following the news.

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